Volume XLI-B3
Int. Arch. Photogramm. Remote Sens. Spatial Inf. Sci., XLI-B3, 27-30, 2016
https://doi.org/10.5194/isprs-archives-XLI-B3-27-2016
© Author(s) 2016. This work is distributed under
the Creative Commons Attribution 3.0 License.
Int. Arch. Photogramm. Remote Sens. Spatial Inf. Sci., XLI-B3, 27-30, 2016
https://doi.org/10.5194/isprs-archives-XLI-B3-27-2016
© Author(s) 2016. This work is distributed under
the Creative Commons Attribution 3.0 License.

  09 Jun 2016

09 Jun 2016

SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

D. Heinemann1, S. Knabner2, and D. Baumgarten1 D. Heinemann et al.
  • 1Institute for Biomedical Engineering and Informatics, Technische Universit¨at Ilmenau, 98693 Ilmenau, Germany
  • 2Ingenieurbro Steffen Knabner, 99441 Magdala, Germany

Keywords: Solder Paste, Photogrammetry, Camera Calibration, 3D-Target, Image Processing, Printed Circuit Board, Jet Printing Inspection

Abstract. Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.