The International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences
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Articles | Volume XLI-B3
Int. Arch. Photogramm. Remote Sens. Spatial Inf. Sci., XLI-B3, 27–30, 2016
https://doi.org/10.5194/isprs-archives-XLI-B3-27-2016
Int. Arch. Photogramm. Remote Sens. Spatial Inf. Sci., XLI-B3, 27–30, 2016
https://doi.org/10.5194/isprs-archives-XLI-B3-27-2016

  09 Jun 2016

09 Jun 2016

SINGLE IMAGE CAMERA CALIBRATION IN CLOSE RANGE PHOTOGRAMMETRY FOR SOLDER JOINT ANALYSIS

D. Heinemann1, S. Knabner2, and D. Baumgarten1 D. Heinemann et al.
  • 1Institute for Biomedical Engineering and Informatics, Technische Universit¨at Ilmenau, 98693 Ilmenau, Germany
  • 2Ingenieurbro Steffen Knabner, 99441 Magdala, Germany

Keywords: Solder Paste, Photogrammetry, Camera Calibration, 3D-Target, Image Processing, Printed Circuit Board, Jet Printing Inspection

Abstract. Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.